usa 858 674 8100 ? ? germany 49 7032 7806 0 ? ? singapore 65 6287 8998 ? ? shanghai 86 21 54643211 / 2 ? ? china 86 755 33966678 ? ? taiwan 886 3 4641811 www.pulseeng.com 38 spm2007 (11/07) smt power inductors shielded drum core - p1170nl/p1171nl series mechanical schematic: weight . . . . . . . . 3.2 grams tape & reel . . . . . . 500/reel dimensions: inches mm unless otherwise specified, all tolerances are .010 0,25 height: 6.0mm max footprint: 12.2mm x 12.2mm max current rating: up to 13a inductance range: .32h to 750h part 2,3 inductance inductance irated 5 dcr (m ) saturation 6 heating 7 core loss 8 srf numbers @0a dc @irated (a dc ) current current factor (mhz) ( h) ( h) min typ max -25% (a) +40c(a) (k2) p1170.901nl p1171.901nl 0.9* 0.6 13 2.0 2.9 14 13 140 >40 p1170.142nl p1171.142nl 1.4* 0.9 11 3.0 4.2 13 11 170 >40 p1170.222nl p1171.222nl 2.2* 1.5 9.6 4.0 5.7 9.7 9.6 210 >40 p1170.302nl p1171.302nl 3.0* 2.0 8.3 5.4 7.7 8.3 8.3 250 38 p1170.392nl p1171.392nl 3.9* 2.5 7.0 7.4 10 7.0 7.1 280 34 p1170.502nl p1171.502nl 5.0* 3.3 6.4 8.5 12 6.4 6.6 310 30 p1170.642nl p1171.642nl 6.4* 4.2 5.3 13 18 5.8 5.3 360 26 p1170.103nl p1171.103nl 10 7.5 4.4 19 25 4.6 4.4 430 24 p1170.123nl p1171.123nl 12 9.0 4.2 21 27 4.3 4.2 470 18 p1170.153nl p1171.153nl 15 11.3 4.0 22 30 4.0 4.1 550 16 p1170.183nl p1171.183nl 18 13.5 3.4 32 40 3.4 3.4 580 14 p1170.223nl p1171.223nl 22 16.5 3.0 36 45 3.0 3.2 670 14 p1170.273nl p1171.273nl 27 20.3 2.7 41 51 2.7 3.0 740 12 p1170.333nl p1171.333nl 33 24.8 2.6 56 70 2.6 2.6 820 11 p1170.393nl p1171.393nl 39 29.3 2.4 60 75 2.4 2.5 880 10 p1170.473nl p1171.473nl 47 35.3 2.2 79 100 2.2 2.2 980 9.0 p1170.563nl p1171.563nl 56 42 2.0 85 110 2.0 2.1 1000 8.0 p1170.683nl p1171.683nl 68 51 1.8 97 120 1.8 1.9 1100 6.9 p1170.823nl p1171.823nl 82 61.5 1.7 127 158 1.7 1.7 1300 6.3 p1170.104nl p1171.104nl 100 75 1.4 182 230 1.4 1.4 1400 5.5 p1170.124nl p1171.124nl 120 90 1.3 201 253 1.3 1.4 1500 5.0 p1170.154nl p1171.154nl 150 113 1.2 225 280 1.2 1.3 1700 4.6 p1170.184nl p1171.184nl 180 135 1.1 249 310 1.1 1.2 1900 3.8 p1170.224nl p1171.224nl 220 165 1.0 319 400 1.0 1.1 2100 3.5 p1170.274nl p1171.274nl 270 203 0.91 363 460 0.91 1.0 2300 3.2 p1170.334nl p1171.334nl 330 248 0.82 539 620 0.82 0.82 2600 3.0 p1170.394nl p1171.394nl 390 293 0.72 561 690 0.72 0.81 2800 2.7 p1170.474nl p1171.474nl 470 353 0.68 629 770 0.68 0.77 3100 2.6 p1170.564nl p1171.564nl 560 420 0.63 851 1060 0.63 0.66 3300 2.3 p1170.684nl p1171.684nl 680 510 0.57 950 1200 0.57 0.62 3700 2.0 p1170.824nl p1171.824nl 820 615 0.52 1241 1550 0.52 0.54 4000 2.0 p1170.105nl p1171.105nl 1000 750 0.46 1398 1750 0.46 0.51 4500 1.5 * inductance at 0a dc tolerance on indicated part numbers is 30%; tolerance is 20% on all other parts. notes from table: (see page 43) electrical specifications @ 25c ? operating temperature -40c to +130c
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usa 858 674 8100 ? ? germany 49 7032 7806 0 ? ? singapore 65 6287 8998 ? ? shanghai 86 21 54643211 / 2 ? ? china 86 755 33966678 ? ? taiwan 886 3 4641811 www.pulseeng.com 43 spm2007 (11/07) smt power inductors shielded drum core series notes from tables (pages 27 - 42) 1. unless otherwise specified, all testing is made at 100khz, 0.1vac. 2. optional tape & reel packaging can be ordered by adding a " t " suffix to the part number (i.e. p1166.102nl becomes p1166.102nl t ). pulse complies with industry standard tape and tape & reel specification eia481. 3. the " nl " suffix indicates an rohs-compliant part number. non-nl suffixed parts are not necessarily rohs compliant, but are electrically and mechanically equivalent to nl versions. if a part number does not have the " nl " suffix, but an rohs compliant version is required, please contact pulse for availability. 4. temperature of the component (ambient plus temperature rise) must be within specified operating temperature range. 5. the rated current (irated) as listed is either the satura- tion current or the heating current depending on which value is lower. 6. the saturation current, isat, is the current at which the component inductance drops by the indicated percentage (typical) at an ambient temperature of 25c. this current is determined by placing the component in the specified ambient environment and applying a short duration pulse current (to eliminate self-heating effects) to the component. 7. the heating current, idc, is the dc current required to raise the component temperature by the indicated delta (approximately). the heating current is determined by mounting the component on a typical pcb and applying current for 30 minutes. the temperature is measured by placing the thermocouple on top of the unit under test. 8. in high volt*time (et) or ripple current applications, addi- tional heating in the component can occur due to core losses in the inductor which may necessitate derating the current in order to limit the temperature rise of the component. in order to determine the approximate total loss (or temperature rise) for a given application, both copper losses and core losses should be taken into account. estimated temperature rise: trise = [total loss (mw) / k0] .833 ( o c ) total loss = copper loss + core loss (mw) copper loss = i rms 2 x dcr (typical) (mw) irms = [i dc 2 + i 2 /12] 1/2 (a) core loss = k1 x f (khz) 1.23 x bac(ga) 2.38 (mw) bac (peak to peak flux density) = k2 x i (ga) [= k2/l(h) x et(v-sec) (ga)] where f varies between 25khz and 1mhz, and bac is less than 2500 gauss. k2 is a core size and winding dependant value and is given for each p/n in the proceeding datasheets. k0 & k1 are platform and material dependant constants and are given in the table below for each platform. pg0085/86 2.3 5.29e-10 pg0087 5.8 15.2e-10 pg0040/41 0.8 2.80e-10 p1174 0.8 6.47e-10 pf0601 4.6 14.0e-10 pf0464 3.6 24.7e-10 pf0465 3.6 33.4e-10 p1166 1.9 29.6e-10 p1167 2.1 42.2e-10 pf0560nl 5.5 136e-10 p1168/69 4.8 184e-10 p1170/71 4.3 201e-10 p1172/73 5.6 411e-10 pf0552nl 8.3 201e-10 pf0553nl 7.1 411e-10 part no. trise factor core loss factor (k0 ) (k1) take note that the component's temperature rise varies depending on the system condition. it is suggested that the component be tested at the system level, to verify the temperature rise of the component during system operation.
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